Grupo Lantero’s rigid packaging business unit will take advantage of the event to showcase its latest developments and continue strengthening relationships with customers and partners across the region.
Coexpan will participate in PACK EXPO International Chicago 2026, one of the leading events for the packaging industry in North America. The company will be present with its own booth, where it will showcase some of its latest solutions and share its perspective on the challenges and opportunities shaping the future of the industry.
The exhibition represents an opportunity to further strengthen Coexpan’s presence in the NORAM market and maintain direct contact with customers, brands, and industry professionals. Throughout the event, the commercial and R&D teams will exchange experiences, explore emerging market trends, and identify new collaboration opportunities.
Solutions focused on sustainability and efficiency
During the show, Coexpan will present a range of developments designed to address growing market demands in areas such as recyclability, material optimization, and the incorporation of recycled content.
The company continues to develop solutions that contribute to more circular packaging models without compromising the quality, functionality, and performance requirements demanded by each application.
“For 50 years, we have been supporting the evolution of packaging across the food and consumer goods industries. Today, our customers are looking for more circular, efficient, and competitive solutions, and our response is based on an integrated offering that combines sheet extrusion, thermoforming, and injection molding, together with the innovation and market expertise needed to transform those requirements into real-world solutions. At PACK EXPO, we are presenting developments that are already reaching the market, supported by our manufacturing capabilities in Mexico, which allow us to serve North America with proximity, efficiency, and competitiveness,” said Iain Sturges, Global Sales Director at Coexpan.
Listening to the market to keep moving forward
Beyond showcasing solutions, PACK EXPO provides Coexpan with an opportunity to gain first-hand insight into the needs of customers and partners, exchange knowledge, and continue strengthening relationships in a key market for the company.
This close connection to the market is a core part of Coexpan’s strategy to develop solutions aligned with the real challenges faced by brands and consumers, with a strong focus on practical innovation and continuous improvement.
A comprehensive packaging vision
PACK EXPO International Chicago 2026 will also feature the participation of Emsur, Grupo Lantero’s flexible packaging division. Its presence will provide a broader perspective on the packaging solutions offered by the group, combining innovation, sustainability, and expertise across multiple packaging technologies to address the evolving needs of the market.
Coexpan invites customers, partners, and industry professionals to visit booth LL-10400 during PACK EXPO International Chicago 2026 to discover first-hand solutions such as rPS Food, PP Easy Form, and ReKeepEat, as well as the initiatives the company is developing to promote more circular and efficient packaging.
